Product Introduction

Starem® Epoxy Molding Compound (EMC) is designed to encapsulate various delicate electronic devices. Starem® EMC features a broad line-up of halogen-free compounds to meet various customers’ needs and requirements.
Product Benefits
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MUF EMC
Excellent assembly yield improvementCurable at low temperature
Void-less molding in fine pitch bump gap
Good gap filling characteristics with high flowability (Applicable for packages with fine pitch)Best productivityWide process windowSuperior releasing performance
Increase in throughput with high cleaning cycle -
PoP-t EMC
Best solution for Warpage control
Optimized technology for a variety of packages
Excellent yield improvementMaximizing customer’s productivity Wide process windowExcellent yield of lamination, improved reliability
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Granule EMC
Excellent moldability with higher spreadabilityShort cure time for higher productivity
Enhancing filling characteristics
No wire sweep/sagging and chip sagging
Void-less molding in complex package configurationExcellent granule size controlWide process windowNo blocking and contamination